• EV COPPER
  • EV COPPER

EV COPPER

EV COPPER for Battery & Electronic Circuits

$0.00
Model:
Double Shiny Electro Copper Foil
HTE Electronic Circuit Copper Foil
RTF Copper Foil
VLP Copper Foil
  • EV COPPER

Description

Double Shiny Electro Copper Foi

Item Unit Technical Parameters
Thickness μm 4.5(0;+2) 6(0;+2) 8(0;+2) 10(0;+2) 12(0;+2)
Unit area weight g/m² 40±1 54±2 72±2 87±2 105±2
Roughness Rz μm ≤3.0
Ra μm ≤0.32
Tensile strength 25℃ MPa ≥300 ≥300 ≥300 ≥300 ≥300
Elongation 25℃ % ≥3 ≥4 ≥5 ≥8 ≥10
Wettability dyn ≥38
Antioxidant capacity - 150℃ 10min No oxidation

HTE Electronic Circuit Copper Foil

Item Unit Technical Parameters
Thickness μm 12 15 18 35 70
Unit area weight g/m² 107±3 125±3 145±3 280±5 585±5
Roughness Rz μm ≤6.0 ≤7.0 ≤8.0 ≤10 ≤12
Tensile strength Ra μm ≤0.32
25℃ MPa ≥350 ≥330 ≥330 ≥320 ≥300
Elongation 180℃ MPa ≥180
25℃ % ≥4.0 ≥4.0 ≥5.0 ≥8.0 ≥12
Peel strength 180℃ % ≥4.0 ≥4.0 ≥5.0 ≥5.0 ≥5.0
FR4 N/mm ≥1.1 ≥1.2 ≥1.4 ≥1.7 ≥2.2
Antioxidant capacity - 200℃ 40min No oxidation

RTF Copper Foil

Item Unit Technical Parameters
Thickness μm 18 35
Unit area weight g/m² 145±5 275±5
Roughness Rz μm ≤2.5 ≤4.0
Rz μm ≤2.0 ≤2.0
Tensile strength 25℃ MPa ≥320 ≥320
Elongation 25℃ % ≥5 ≥8
Peel strength N/mm 1.2 1.2
Antioxidant capacity - 200℃ 40min No oxidation

VLP Copper Foil

Item Unit Technical Parameters
Thickness μm 12 18 35
Unit area weight g/m² 107±2 153±3 285±5
Roughness M Rz μm ≤2.5 ≤2.5 ≤2.5
S Ra μm ≤0.32
Tensile strength 25℃ MPa ≥300
180℃ MPa ≥180
Elongation 25℃ % ≥6.0 ≥6.0 ≥6.0
180℃ % ≥4.0 ≥5.0 ≥5.0
Peel strength N/mm ≥0.75 ≥0.75 ≥0.85
Antioxidant capacity - 200℃ 40min No oxidation