Description
BRONZE C5071
| Alloy Grade |
Chemical Composition |
| China GB |
USA UNS |
EURO EN |
JAPAN JIS |
Cu % |
Sn % |
P % |
| QSn1.8 |
C50700 |
CuSn1.8 |
C5071 |
Balance |
1.7 - 2.3 |
≤0.15 |
| Density G/Cm³ |
Conductivity %IACS |
Thermal Conductivity W/(M·K) |
Modulus Of Elasticity GPa |
Specific Heat J/(G·K) |
Thermal Expansion Coefcien 10⁻⁶/K |
Cold-Workability |
Machinability |
Plating Capability |
Hot Dip Tin Plating Property |
Weldability |
| 8.88 |
30 |
155 |
124 |
0.375 |
17 |
Excellent |
General |
Excellent |
Excellent |
Good |
| Temper |
HV Hardness |
Tension test |
Bend properties |
| MPa Tensile strength |
Elongation % |
Thickness mm |
Bend angle |
Bend properties - Bend radius |
| 060 |
- |
≥315 |
≥30 |
- |
180° |
- |
| H02 |
125 - 165 |
410 - 510 |
≥10 |
- |
- |
Thickness*Twice |
| H04 |
150 - 185 |
490 - 590 |
≥5 |
0.1 - 0.5 |
180° or W |
Thickness*4 times |
| H06 |
150 - 205 |
540 - 635 |
≥2 |
0.05 - 0.5 |
180° or W |
Thickness*6 times |
| H08 |
≥185 |
610 - 705 |
- |
- |
- |
- |
BRONZE C5111
| Alloy Grade |
Chemical Composition |
| China GB |
USA UNS |
EURO EN |
JAPAN JIS |
Cu % |
Sn % |
P % |
| QSn4 - 0.3 |
C51100 |
CuSn4 |
C5111 |
Balance |
3.5 - 4.9 |
0.03 - 0.35 |
| Density G/Cm³ |
Conductivity %IACS |
Thermal Conductivity W/(M·K) |
Modulus Of Elasticity GPa |
Specific Heat J/(G·K) |
Thermal Expansion Coefcien 10⁻⁶/K |
Cold-Workability |
Machinability |
Plating Capability |
Hot Dip Tin Plating Property |
Weldability |
| 8.86 |
18 |
84 |
117 |
0.377 |
17.8 |
Excellent |
Unsuitable |
Excellent |
Excellent |
Good |